UV Laser Marking Machine
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PCB Laser Marking Machine
Structuring of TCO/ITO Layers With the UV Laser Transparent conductive oxides (TCOs) are electrically conducting materials that are applied in thin layers to transparent substrate materials. ITO layers are especially common. They can be structured very selectively with the UV laser. Finest insulation on invisible layers Advantages of Laser Structuring of TCO/ITO Layers Absolutely invisible structuring of transparent ITO coatings No damage to the substrate material Flexibility: Layout can be ... -
Inline PCB Laser Marking Machine
Introduction Specification Capability to mark text, barcodes, 2D codes and graphics. Conveyor width adjustment using hand crank PCB side clamping Rigid machine structure with large access doors Mechanical PCB lift for constant focal point Fast product change-over Selectable by-pass operation Readability check with CCD camera Three level brightness camera (lighting) Uninterruptible power supply (UPS) Towerlight will show machine status Controlled by industrial PC and CE... -
10W Electric Wire And Cable UV Laser Marking Machine
Chanxan uv laser marking machine can achieve hyperfine marking,the heat affecting area very small,it won’t have heat effect, there is no burning problem,pollution-free,high marking speed,high efficiency and suitable performance.High quality and special design. solid aluminium protection cover for optical path, also with two small fan ensure the cooling effect more better.
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Micro Drilled Holes for Components
The laser drilling process is an inexpensive alternative to mechanical drilling, and very adaptable for small holes with large depth to diameter ratios. Precision laser drilling provides a repeatable, accurate hole that can be customized for all types of manufacturing industries.
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UV Laser Marking Machine CX-03Z/05Z/10Z
Suitable for high-edn market for ultra-fine processing,such as moblie phones,chargers,data cables,pharmaceutical packages,cosmetics packages,and polymer materials surface marking.Also it can be used for marking of flexible PCB boards,dicing;micro-holes and blind holes for silicon wafers,LCDQA code marking,glassware punching,metal surface marking,plastic buttons,electronic components,gifts,communication equipment,buliding materials marking,etc.
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