Suitable for high-edn market for ultra-fine processing,such as moblie phones,chargers,data cables,pharmaceutical packages,cosmetics packages,and polymer materials surface marking.Also it can be used for marking of flexible PCB boards,dicing;micro-holes and blind holes for silicon wafers,LCDQA code marking,glassware punching,metal surface marking,plastic buttons,electronic components,gifts,communication equipment,buliding materials marking,etc.
|Marking speed||500 characters/sec||500 characters/sec|
|cooling type||Industrinal thermostat system||Industrinal thermostat system|
|Power Supply||AC110V/220V±10% 50Hz/60HZ||AC110V/220V±10% 50Hz/60HZ|
1. Low cost. 3C manufacturers, especially OEM/EMS manufacturing manufacturers, mainly rely on output to earn benefits, reducing production and manufacturing processes, and reducing the production of additional consumables are the goals pursued by these manufacturers. Lasers are non-contact processing, with low thermal impact and small processing areas. , Flexible method, no consumables and other features, which can greatly help manufacturers reduce procedures and reduce costs.
2. Process innovation. 3C products are personalized and popular consumer products. Only by constantly creating new highlights in shape and function can they attract consumers. Users have great expectations for laser processing in product process innovation, especially precision processing. Optical quality requirements are high. For example, fine and deep optical fiber can completely replace the previous etching and engraving. For example, laser color marking, especially black, can completely replace the previous printing and labeling, and the above two processes can reduce the production and manufacturing process. , To reduce the production of additional consumables, especially to avoid the consumables that will cause environmental pollution such as ink labels. Greatly reduce costs.
3. Become the mainstream. Due to the versatility of laser and the more foresighted process, the application of laser technology in the 3C industry has changed from an optional process to the current mainstream application; especially under the premise of precision processing, traditional printing, stamping, CNC and other processes have been Can not meet the increasing processing demand.