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UV FPC Laser Cutting Machine
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Wafer Laser Dicing，Stealth laser cutting
Application Silicon wafer with metal film on the back, GaP (gallium phosphide) wafer, InP (indium phosphide) wafer, GaN (gallium nitride) wafer, Ge (germanium) wafer, etc. GaAs wafers are brittle and prone to cracking or chipping during cutting, so it is difficult to increase the feed speed of the usual grinding wheel blade cutting. If the laser full cutting technology is used, the processing feed rate can reach more than 10 times the cutting feed rate of the grinding wheel blade, thereby i... -
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