Researching & teaching Field
Through continuous innovation,Chanxan Laser has emtered many scientific research institutions and universities with various equipment to explore new laser techology together and cultivate new laser talents.The institutions that have successfully cooperated include the institute of Micro-Matter of the Chinese Academy of Sciences,Peking University,Nanjing Aeronautical University,SuZhou University.Chanxan has created an example of school-enterprise cooperation with more than dozens of domestic first-class institutes and unversities.
Precision laser experiment/teaching Field
● The high beam quality fiber laser used in laser cutting/scribing has little electrical influence on the chip, which can improve the scribing yield;
● It can work on wafers of different thicknesses, with better compatibility and versatility;
● It can cut some more complicated wafer chips, such as hexagonal die, etc.;
● No need of deionized water, there is no problem of tool wear, and it can be operated continuously for 24 hours.
|Scribing equipment||Traditional dicing method (grinding wheel)||Laser scribing method (laser)|
|Cutting line width||30～40||30～45|
|Cutting effect||Easy break||Smooth and flat, not easy to break|
|Heat affected zone||Bigger||Smaller|
|Requirements for wafer thickness||100 um以上||No thickness requirement|
|Adaptability||Need to change tool||Can adapt to different types of wafers|
|Loss||Need deionized water, large loss||Low loss|