Picosecond UV Laser Cutting Machine

Picosecond UV Laser Cutting Machine

  • Laser drilling micro holes

    Laser drilling micro holes

    Applicable for the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.

  • Picosecond Laser Cutting Machine for Glass Coverslip

    Picosecond Laser Cutting Machine for Glass Coverslip

    Important Application Laser Micromachining Thin Glass for Biotech Applications. Glass coverslip laser cut. Laser trimming thick film resistors. Glass & Sapphire Laser Cutting. Laser scoring glass. Applied Industry Color Filters FPD (Flat Panel Display) Manufacturing Smaller Touch Screens. Precision Glass Fabrication. Micro displays. Microscope Slides and Covers. Contact us
  • Picosecond Laser Automatic Silicon Wafer Dicing Machine

    Picosecond Laser Automatic Silicon Wafer Dicing Machine

    The high-quality attributes of the UV wavelength allow for the cutting and drilling of delicate materials with minimal heat affected zone – and the proof is in the results: clean side-walls with precise dimensions and virtually zero debris.

  • Laser Micro Machining Machine

    Laser Micro Machining Machine

    Ultrafast Laser Micromachining New lasers technology fill the need for precision micromachining in smartphones, automotive components and medical devices. Main features High fabrication speed – up to 300 mm/s (more on request) Fabrication of complex objects with submicron resolution High-performance galvanometer scanners Pulse density control Precise object positioning with submicron accuracy Object movement and laser pulse synchronization in time and space. Specifications Precise obj...