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Picosecond UV Laser Cutting Machine
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Laser drilling micro holes
Applicable for the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.
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Picosecond Laser Cutting Machine for Glass Coverslip
Important Application Laser Micromachining Thin Glass for Biotech Applications. Glass coverslip laser cut. Laser trimming thick film resistors. Glass & Sapphire Laser Cutting. Laser scoring glass. Applied Industry Color Filters FPD (Flat Panel Display) Manufacturing Smaller Touch Screens. Precision Glass Fabrication. Micro displays. Microscope Slides and Covers. Contact us -
Picosecond Laser Automatic Silicon Wafer Dicing Machine
The high-quality attributes of the UV wavelength allow for the cutting and drilling of delicate materials with minimal heat affected zone – and the proof is in the results: clean side-walls with precise dimensions and virtually zero debris.
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Laser Micro Machining Machine
Ultrafast Laser Micromachining New lasers technology fill the need for precision micromachining in smartphones, automotive components and medical devices. Main features High fabrication speed – up to 300 mm/s (more on request) Fabrication of complex objects with submicron resolution High-performance galvanometer scanners Pulse density control Precise object positioning with submicron accuracy Object movement and laser pulse synchronization in time and space. Specifications Precise obj...
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