1. With high-performance UV lase and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
1.The flexible PCB marking, scribing.
2.Porous silicon wafers, blind hole processing.
3.LCD glass qr code marking, punching.
4.Metal surface coating glassware surface marking.
5.Plastic buttons, electronics, gifts.
6.Communications equipment, building materials and so on.Ceramics
The laser drilling process is an inexpensive alternative to mechanical drilling, and very adaptable for small holes with large depth to diameter ratios. Precision laser drilling provides a repeatable, accurate hole that can be customized for all types of manufacturing industries.