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Micro-precision Laser Cutting and Drilling
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Wafer Laser Dicing，Stealth laser cutting
Application Silicon wafer with metal film on the back, GaP (gallium phosphide) wafer, InP (indium phosphide) wafer, GaN (gallium nitride) wafer, Ge (germanium) wafer, etc. GaAs wafers are brittle and prone to cracking or chipping during cutting, so it is difficult to increase the feed speed of the usual grinding wheel blade cutting. If the laser full cutting technology is used, the processing feed rate can reach more than 10 times the cutting feed rate of the grinding wheel blade, thereby i... -
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Alumina Ceramic Substrate Laser Cutting machine
Laser Machining Ceramic Substrate Chanxan have excellent laser service for Al2O3, ALN substrate. Laser Processing Service for Ceramic substrate： 1.Laser Cutting, Scribing, and Drilling service for ceramic substrate. 2.Chanxan provide the design, laser express and surface treatment consultation service. 3.Customization is available. Contact us -
Laser drilling micro holes
Applicable for the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.
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Picosecond Laser Cutting Machine for Glass Coverslip
Important Application Laser Micromachining Thin Glass for Biotech Applications. Glass coverslip laser cut. Laser trimming thick film resistors. Glass & Sapphire Laser Cutting. Laser scoring glass. Applied Industry Color Filters FPD (Flat Panel Display) Manufacturing Smaller Touch Screens. Precision Glass Fabrication. Micro displays. Microscope Slides and Covers. Contact us -
Lithium Niobate Laser Cutting
Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal. Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of... -
PCB Laser Cutting Machine
1. With high-performance UV lase and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system. -
Drilling Precise Holes in Glass Femto Laser Glass Cutting
Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal. Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of... -
Femto laser glass cutting, Glass micro drilling
Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal. Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of... -
UV Laser Drilling Machine, PCB Drilling Machine, FPC Laser Drilling Machine
Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal. Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of... -
Picosecond Laser Automatic Silicon Wafer Dicing Machine
The high-quality attributes of the UV wavelength allow for the cutting and drilling of delicate materials with minimal heat affected zone – and the proof is in the results: clean side-walls with precise dimensions and virtually zero debris.
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Laser Micro Machining Machine
Ultrafast Laser Micromachining New lasers technology fill the need for precision micromachining in smartphones, automotive components and medical devices. Main features High fabrication speed – up to 300 mm/s (more on request) Fabrication of complex objects with submicron resolution High-performance galvanometer scanners Pulse density control Precise object positioning with submicron accuracy Object movement and laser pulse synchronization in time and space. Specifications Precise obj...
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