Applicable for the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.
1. With high-performance UV lase and self-developed control software.
2. With the high-precision motion platform system and high-precision galvanometer scanner.
3. With high-precision CCD positioning system.
The high-quality attributes of the UV wavelength allow for the cutting and drilling of delicate materials with minimal heat affected zone – and the proof is in the results: clean side-walls with precise dimensions and virtually zero debris.