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Laser drilling micro holes

Details

Machine introduction

Brief Description

 

Applicable for the high-speed specially-shaped cutting of glass and sapphire with
DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover
plate of Home key, and optical lens.

Features :

1、Glass thickness: 0.1-1.2mm

2、Edge breakage size: <0.005mm

3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL<50µm, T=0.7mm Corning

4、Non-contact processing, little damage to the material, high cutting precision

 

Parameter

Processing scope 150X150mmAutomatic);
300X250mmManual
Platform repeated positioning precision ±1μm
Platform dynamic positioning precision ±3μm
Max. moving speed of platform 1000mm/s
CCD positioning precision ±0.01mm
Laser type Infrared picosecond
Edge breakage value ≤10μm
Wavelength 1064nm
whole power 1500W
Net weight 300KG
work temperature 1℃-45℃
machine dimension 1900mm*1550*1130mm

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Application Materials

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  • ONLINE MESSAGE

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