The high-quality attributes of the UV wavelength allow for the cutting and drilling of delicate materials with minimal heat affected zone – and the proof is in the results: clean side-walls with precise dimensions and virtually zero debris.
1.The flexible PCB marking, scribing.
2.Porous silicon wafers, blind hole processing.
3.LCD glass qr code marking, punching.
4.Metal surface coating glassware surface marking.
5.Plastic buttons, electronics, gifts.
6.Communications equipment, building materials and so on.Ceramics
The laser drilling process is an inexpensive alternative to mechanical drilling, and very adaptable for small holes with large depth to diameter ratios. Precision laser drilling provides a repeatable, accurate hole that can be customized for all types of manufacturing industries.