Products

Products

  • Laser cutter for fabric
  • CO2 Laser Cutting Machine CW-1410TS

    CO2 Laser Cutting Machine CW-1410TS

    Non-contact cutting, very friendly to the elastic fabric, the visual positioning system, accurate search for the frame, accurate cutting. High-precision positioning, one-time forming, smooth and flat edges compared with traditional crafts, the products are more beautiful and beautiful, more efficient, and save materials.

  • Laser Cutting Machine CW-1310

    Laser Cutting Machine CW-1310

    Approximate possibilities of laser cutting   Laser power Acrylic(мм) Plywood(мм) MDF(мм) 40 watt 3 2 1,5 50 watt 5 4 2,5 60 watt 8 5 3 80 watt 12 8 6 100 watt 15 12 9 130 watt 20 15 12 150 watt 25 20 15
  • Acrylic Laser Cutting Machine

    Acrylic Laser Cutting Machine

    Very good at cutting big size design, Widely used, Energy saver, whole machine max power consumption is only 2.5KW.  easy operate, specialized working system The development goal of CM series laser equipment is to give full play to the performance of motion control.

  • Laser drilling micro holes

    Laser drilling micro holes

    Applicable for the high-speed specially-shaped cutting of glass and sapphire with DOL<50µm, cover plate glass of mobile phone, protective lens of camera, cover plate of Home key, and optical lens.

  • Plywood Laser Cutting Machine

    Plywood Laser Cutting Machine

    Very good at cutting big size design, Widely used, Energy saver, whole machine max power consumption is only 2.5KW.  easy operate, specialized working system The development goal of CM series laser equipment is to give full play to the performance of motion control.

  • Drilling Precise Holes in Glass Femto Laser Glass Cutting

    Drilling Precise Holes in Glass Femto Laser Glass Cutting

    Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal.   Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of...
  • Femto laser glass cutting, Glass micro drilling

    Femto laser glass cutting, Glass micro drilling

    Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal.   Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of...
  • PCB Laser Marking Machine

    PCB Laser Marking Machine

    Structuring of TCO/ITO Layers With the UV Laser Transparent conductive oxides (TCOs) are electrically conducting materials that are applied in thin layers to transparent substrate materials. ITO layers are especially common. They can be structured very selectively with the UV laser. Finest insulation on invisible layers Advantages of Laser Structuring of TCO/ITO Layers Absolutely invisible structuring of transparent ITO coatings No damage to the substrate material Flexibility: Layout can be ...
  • UV Laser Drilling Machine, PCB Drilling Machine, FPC Laser Drilling Machine

    UV Laser Drilling Machine, PCB Drilling Machine, FPC Laser Drilling Machine

    Drilling – specifically laser drilling – is a process that can be used to make micro-holes in almost any material. Pulsed lasers effectively complete this work by depositing very small, finite amounts of energy into a material, resulting in extremely precise and reproducible material removal.   Brief Description 1.Realize X, Y, Z motion control in three directions; 2.Real-time controls the rotation of the laser and changes of processing tilt angle; 3. By setting different combination of...
  • Picosecond Laser Automatic Silicon Wafer Dicing Machine

    Picosecond Laser Automatic Silicon Wafer Dicing Machine

    The high-quality attributes of the UV wavelength allow for the cutting and drilling of delicate materials with minimal heat affected zone – and the proof is in the results: clean side-walls with precise dimensions and virtually zero debris.

  • Medical Coronary Stent Cutting/Micromachining NiTi Tubes

    Medical Coronary Stent Cutting/Micromachining NiTi Tubes

    Medical Coronary Stent Cutting/Micromachining NiTi Tubes

    laser micromachining, laser tube cutting , tube-cutting, laser tube cutting machines

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